Blog: Page 7
XMOS recently attended the 2014 IEEE-SA Ethernet & IP @ Automotive Technology Day in Detroit. The event is in its fourth annual edition and was held for the first time in the US, after previous events were held in Germany. It was also the first time the event was organized through the IEEE Standards Association, a sign of the growing applicability and maturity of Ethernet as a technology in the automotive industry.
The theme of the event was “Moving towards a mature and pervasive automotive network: from infotainment to autonomous driving, how Ethernet is uniquely qualified to transform the vehicle”. The two-day conference program showcased a number of themes, including the status of IEEE standardization efforts and physical layer developments that will enable an automotive Gigabit Ethernet network. New applications and use cases of the technology, security aspects, and testing methods and tools were also presented.
I co-presented on "AVB in Automotive Infotainment Networks” alongside Günter Dannhäuser from Daimler. The presentation focused on work that we have been doing with Daimler to reduce the startup time of XMOS AVB endpoints to meet a number of use-cases in automotive. Through a combination of hardware and firmware optimization, we presented a reduction from 7 seconds to just over 500ms from cold boot to first audio output.
You can see our presentation slides here.
A new aspect of the 2014 event was a joint session with the 7th AUTOSAR Open Conference where the software aspects and the Ethernet integration into the AUTOSAR software platform were presented and discussed. Marc Weber from Vector Informatik presented a roadmap to integrate AVB driver capability in a future version of AUTOSAR.
The event was a unique opportunity for OEMs, suppliers, semiconductor vendors and tool providers to come together. In parallel with the conference, XMOS exhibited alongside forty other companies, which allowed participants to experience the technology and directly interact with vendors. We showed XMOS AVB Daisy Chain endpoints, streaming audio to and from an Apple Mac, via a single twisted pair using Broadcom BroadR-Reach PHYs. A number of other vendors were showing XMOS endpoints interoperating with their equipment.
With the recent innovations in vehicle electronics in the Infotainment, Active Safety, Powertrain and Body domains, there is greater need than ever for a new generation of network that can scale with the bandwidth, time synchronization and quality-of-service needs of endpoints. There was consensus at the event that Ethernet and AVB/TSN meets these needs and will be prevalent in cars in the coming years.
Haptics has been defined in academia as “the science of applying touch (tactile) sensation and control to interaction with computer applications”. By using input/output devices users can receive feedback from computer applications in the form of ‘felt’ sensations. The potential uses for haptics technology are almost infinite and blogs such as: Haptic Antics and Haptic Feedback are great places to do some further reading.
In this blog post I’ll be explaining some of the specialist language used in the haptics domain and providing an overview of the technologies involved. I’ll be following this up with a series of posts looking at how haptics technology can be applied to markets such as the automotive, consumer electronics and home appliances industries.
I had the chance of speaking at Wuthering Bytes / OSHCAMP this year along with the pleasure of running workshops on the Sunday. I chose to talk about concurrency in the embedded world and focused on what I termed "the concurrency grey scale". This grey scale has simple low cost microcontrollers at the lower end and highly parallel FPGAs at the other.
Following the close of the academic year at Bristol University’s Computer Science faculty – and as we now look forward to new one – it is time to announce and congratulate the winner of the XMOS Prize 2014.
The XMOS team in China are just taking a breath after three busy days at the Shenzhen IPC & Embedded Expo. With one day left to go before the roadshow event rolls on to Beijing, the XMOS stand has been a hub of activity with demonstrations taking place of our Motor and Motion Control solution, AVB, and various USB Audio applications.
We are also providing a demonstration of Sony’s PHA-2 Headphone Amplifier, utilizing XMOS xCORE technology. And you'll be able to see startKIT, the low-cost development kit that makes multicore technology accessible to any embedded developer.
As China’s largest event targeting the IPC and Embedded industries, the IPC and Embedded Expo takes in six days of events across four cities during the month of August. In addition to this week’s Shenzhen event, the Expo visits:
August 12th - Beijing (China National Convention Centre)
August 15th - Shanghai (Sheraton Hotel Hongqiao)
August 19th - Chengdu (Crowne Plaza Chengdu City Center)
The XMOS team will be exhibiting at each location, and will be happy to answer any questions you may have about our xCORE technology and its potentia applications.
So why not visit our stand at one of these events and learn more about our range of xCORE devices:
Beijing – Booth B08
Shanghai – Booth S09
Chengdu – Booth C03