Blog: Page 8
The XMOS team in China are just taking a breath after three busy days at the Shenzhen IPC & Embedded Expo. With one day left to go before the roadshow event rolls on to Beijing, the XMOS stand has been a hub of activity with demonstrations taking place of our Motor and Motion Control solution, AVB, and various USB Audio applications.
We are also providing a demonstration of Sony’s PHA-2 Headphone Amplifier, utilizing XMOS xCORE technology. And you'll be able to see startKIT, the low-cost development kit that makes multicore technology accessible to any embedded developer.
As China’s largest event targeting the IPC and Embedded industries, the IPC and Embedded Expo takes in six days of events across four cities during the month of August. In addition to this week’s Shenzhen event, the Expo visits:
August 12th - Beijing (China National Convention Centre)
August 15th - Shanghai (Sheraton Hotel Hongqiao)
August 19th - Chengdu (Crowne Plaza Chengdu City Center)
The XMOS team will be exhibiting at each location, and will be happy to answer any questions you may have about our xCORE technology and its potentia applications.
So why not visit our stand at one of these events and learn more about our range of xCORE devices:
Beijing – Booth B08
Shanghai – Booth S09
Chengdu – Booth C03
XMOS and Synapticon have been working together now for almost three years. During that time, I’ve been impressed with the level of innovation that Synapticon have brought to the field of cyber-physical systems – advanced motion control combined with a revolutionary way of composing designs virtually using the OBLAC system. At the same time, they’ve used the capabilities of the xCORE architecture to deliver class-leading performance and reduce both the cost and time-to-market for these systems. So naturally, when we began to discuss deepening our collaboration, I was very excited at the prospect of helping to bring these two innovative companies together.
Last month I attended the Future World Symposium. This event is a two-day foray into the near future, looking at products and projects that we may soon be interacting with on a daily basis, and covering such topics as the Internet of Things (IoT) and machine intelligence.
Here in the UK there has been a great deal of interest in the IoT, but my main takeaway from the FWS event was not the expected proliferation of connected devices throughout the world, which although impressive (50bn expected by the year 2020), will be largely just a data and efficiency boon for various industries and yield little to the consumer.
In April we ran a competition for members of our XCore Community – with the prize being a full xCORE Analog sliceKIT. We asked entrants to share a 10-word project idea, for which xCORE technology may be of value.
XMOS recently attended the Future World Symposium (FWS) held at Twickenham Stadium in the UK. This two-day event, hosted by the UK’s National Microelectronics Institute (NMI) and held every two years, was attended by some 190+ delegates and brought together some of the leading names and voices in the world of electronic embedded systems and software.