VocalFusion voice processor for conference calling

Our high-performance digital signal processing solutions make the quietest voice in the room stand out and remove unwanted background noise to deliver outstanding sound performance. Our mono-AEC voice processor gives you up-close voice capture and processing accuracy at far-field range – even in noisy environments. Ideal if you’re looking for a cleaner, sharper conference call sound.

Distance

Accurate voice capture and barge-in from across the room, from across the room and for even the quietest of voices.

Clarity

Mono-acoustic echo cancellation, noise suppression and dereverberation cut unwanted noise and echo for clear sound capture

Direction

Beamforming tracks the speaker of interest so you get best in class performance at all angles and over long distances.

Our rich optimisation parameters for the XVF3100 voice processor lets you adjust for noise attenuation, gain control and residual echo so you can tailor the best voice capture performance for your product. And our engineers are on hand to help you move rapidly from prototype to tuning, and from testing to volume production with a world-class product.

Development Kit

XK-VF3100-C43

  • VocalFusion 4-mic mono-AEC circular development kit

    XVF3100 processor board

    • Micro-USB connector for power (optional USB2.0 device connectivity)
    • Low jitter, audio quality clock
    • DAC with integrated headphone amplifier
    • 4 configurable user input buttons
    • 13 user-controlled LEDs
    • xTAG interface for JTAG debug

    XVF3100 voice processor (programmable for far-field voice capture)

    • Wake-word engine by Sensory
    • Full duplex Acoustic Echo Cancellation (AEC)
    • Barge-in
    • 4-microphone adaptive beamformer
    • Dereverberation
    • Noise suppression
    • Automatic Gain Control (AGC)
    • Direction of arrival (DOA) indication

    Microphone Array

    • Circular, 90mm diameter
    • 4 x Infineon IM69D130 PDM (Pulse Density Modulation) MEMS microphones
    • 43mm radius microphone spacing

    Connectivity

    • Inter-Integrated Sound (I2S) audio interfaces
    • Inter-Integrated Circuit (I2C) serial control interface
    • High speed USB2.0 compliant
    • Multi-channel USB audio class 1.0
    • 128-pin TQFP package 0.4 pitch

Silicon

XK-VF3100-TQ128-C

  • to be confirmed