() has 26 years experience in the electronics and semiconductor industry working in the UK, USA and Canada. Prior to XMOS, Neil was an engineering Vice President for Conexant Systems in New Jersey, where he led an 80-strong international digital chip design team delivering both network-end and consumer-end xDSL silicon products. He has held a variety of technical, commercial and senior management roles at Brown Boveri, Marconi Instruments, Wandel & Goltermann, STMicroelectronics and Virata/Globespan/Conexant. Neil holds a BSc (Hons) in Electrical and Electronic Eng.